Fold flex circuit for lnop

ABSTRACT

Various sensors and methods of assembling sensors are described. In some embodiments, the sensor assembly includes a first end, a body portion, and a second end. The first end can include a neck portion and a connector portion and the second end can include a flap, a first component, a neck portion, and a second component. A method is also described for sensor folding. The method can include using a circuit with an attached emitter and a detector that is separated by a portion of the circuit. The method can also include folding the portion of the circuit such that a first fold is created through the emitter and folding the portion of the circuit such that a second fold is created such that the first fold and second fold form an angle.

INCORPORATION BY REFERENCE TO ANY PRIORITY APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.15/017,505, filed Feb. 5, 2016, which claims the priority benefit under35 U.S.C. § 119(e) of U.S. Provisional Application No. 62/112,918, filedFeb. 6, 2015, and U.S. Provisional Application No. 62/212,071, filedAug. 31, 2015, the entire contents of which are hereby incorporated byreference and should be considered a part of this specification. Any andall applications for which a foreign or domestic priority claim isidentified in the Application Data Sheet as filed with the presentapplication are hereby incorporated by reference under 37 CFR 1.57.

FIELD OF THE DISCLOSURE

The present disclosure relates to low-noise, disposable and reusableoptical probes which may be used to sense optical energy passed througha medium to determine the characteristics of the medium.

BACKGROUND

Energy is can be transmitted through or reflected from a medium todetermine characteristics of the medium. For example, in the medicalfield, instead of extracting material from a patient's body for testing,light or sound energy may be caused to be incident on the patient's bodyand transmitted (or reflected) energy may be measured to determineinformation about the material through which the energy has passed. Thistype of non-invasive measurement is more comfortable for the patient andcan be performed in real time.

Non-invasive physiological monitoring of bodily functions is oftenrequired. For example, during surgery, blood pressure and the body'savailable supply of oxygen, or the blood oxygen saturation, are oftenmonitored. Measurements such as these are often performed withnon-invasive techniques where assessments are made by measuring theratio of incident to transmitted (or reflected) light through a portionof the body, for example a digit such as a finger, or an earlobe, or aforehead.

Demand has increased for disposable and reusable optical probes whichare suitably constructed to provide low-noise signals to be output to asignal processor in order to determine the characteristics of themedium. Many difficulties relating to motion-induced noise have beenencountered in providing such an optical probe inexpensively. A needthus exists for a low-cost, low-noise optical probe and for a method ofefficient manufacturing such a probe.

SUMMARY OF THE DISCLOSURE

The present disclosure discloses a probe for use in non-invasive opticalmeasurements. One aspect of the present disclosure is an optical probefor non-invasive measurement of characteristics of a medium, wherein theprobe has an emitter which transmits optical radiation and a detectorconfigured to detect the optical radiation transmitted by the emitter.The probe also has a flexible circuit assembly having circuit paths forconnection with the emitter and the detector

The present disclosure describes a low cost sensor and a streamlinedassembly method for optimized material usage for the use of flexibleprinted circuit and other sensor materials. In some embodiments, theconfiguration of the sensors is intended to maximize the amount ofmaterial used so as to keep material cost to a minimum.

In one advantageous embodiment, the manufactured flex circuit can befolded into a number of different configurations while maintaining theproperties and integrity of the original flex circuit. In this way, thesame streamlined assembly method can be used to manufacture flexcircuits with a plurality of configurations.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A illustrates a top view of an embodiment of a flexible circuitfor use in a sensor assembly.

FIG. 1B illustrates a bottom view of an embodiment of a flexible circuitfor use in a sensor assembly

FIG. 2A illustrates a top view of one embodiment of a flexible printedcircuit panel array.

FIG. 2B-2C illustrate a top and bottom view of one end of the sensorassembly.

FIG. 3A illustrates an exploded view of an embodiment of a sensorassembly.

FIG. 3B illustrates one embodiment of a sheet comprising a plurality ofnested top panel shields that forms a part of the flexible printedcircuit panel array shown in FIG. 2.

FIG. 3C illustrates one embodiment of a sheet comprising a top panelcoverlay that forms a part of the flexible printed circuit panel arrayshown in FIG. 2.

FIG. 3D illustrates one embodiment of a “sheet” comprising a pluralityof nested traces that form a part of the flexible printed circuit panelarray shown in FIG. 2.

FIG. 3E illustrates one embodiment of a sheet comprising a plurality ofnested bottom coverlay that forms a part of the flexible printed circuitarray shown in FIG. 2.

FIG. 3F illustrates one embodiment of a sheet comprising a plurality ofnested bottom panel shields that forms a part of the flexible printedcircuit array shown in FIG. 2.

FIG. 4A illustrates a top view of a first embodiment of a shield gridused in one embodiment of the sensor assembly.

FIG. 4B illustrates a top view of a second embodiment of a shield gridused in one embodiment of the sensor assembly.

FIG. 4C illustrates a top view of a third embodiment of a shield gridused in one embodiment of the sensor assembly.

FIG. 4D illustrates a top view of a fourth embodiment of a shield gridused in one embodiment of the sensor assembly.

FIG. 4E illustrates a top view of a fifth embodiment of a shield gridused in one embodiment of the sensor assembly.

FIGS. 5A-5D illustrate one embodiment of the sensor assembly.

FIG. 6A illustrates a flow chart illustrating an embodiment of a methodfor sensor folding.

FIG. 6B illustrates an embodiment of a sensor assembly in the method forsensor folding prior to the folding of the sensor.

FIG. 6C illustrates a first step in the method for sensor foldingwherein the neck of the sensor is bent in a first direction.

FIG. 6D illustrates a second step in the method for sensor foldingwherein the neck of the sensor is bent in a second direction.

DETAILED DESCRIPTION

The present disclosure provides a low cost sensor and methods ofassembly and manufacture of the low cost sensor. In some embodiments,the sensor circuits are configured such that each of the flex circuitsfor each of the plurality of sensors is tessellated or nested with oneanother as it is manufactured. In some embodiments, this configurationmaximizes the number of circuits that can be manufactured and assembledfrom a set of materials. Such a configuration further minimizes theamount of material wasted.

The present disclosure also describes a method for assembling anL-shaped sensor or bent sensor from a straight sensor. Previousmanufacturing methods for L-shaped sensors created substantial waste asthe profile of the L-shaped sensor prevented the flex circuits frombeing printed in a staggered formation so as to maximize the use of thesubstrate material. By assembling the L-shaped sensor from a straightsensor, the profile of the flex circuit is minimized and the amount ofwaste is therefore minimized. The method of folding described belowallows a plurality of different sensor shapes to be manufactured from astraight sensor.

FIGS. 1-2 illustrate various views of the flex circuit 100 of the sensorassembly. FIGS. 1A-1B shows one embodiment of the flex circuit 100 ofthe sensor. FIG. 1A shows a top view of the flex circuit 100. The flexcircuit 100 has a detector end 110 and a connector end 120. FIG. 1Bshows a bottom view of the flex circuit 100 and the correspondingdetector end 110 and connector end 120. As can be seen, the flex circuit100 is generally linear and has a minimal profile that can help tomaximize the number of flex circuits that can be printed on substratematerial.

In some embodiments, the configuration of the flex circuit 100 can beconfigured to maximize the substrate material that is used and tominimize waste. FIG. 2A illustrates a flexible printed circuit panelarray 200 that includes a first row of flexible circuit 202 that isnested with a second row of flexible circuits 204. In some example, thefirst row of flexible circuits 202 and the second row of flexiblecircuits 204 can be identical.

As illustrated in FIG. 2A, the first and second rows of flexiblecircuits 202, 204 can include a connector end 208 and a detector end206. In some embodiments the first row of flexible circuits 202 and thesecond row of flexible circuits 204 are configured such that, on one endof the flexible printed circuit panel array 200, the connector end 208of the first row of flexible circuit 202 is proximate to the detectorend 206 of the second row of flexible circuit 204 and on the other end,the connector end 208 of the second row of flexible circuit 202 isproximate to the detector end 206 of the first row of flexible circuit204.

In addition to the nested configuration, each of the flex circuits 100has a body portion 232 that is uniform along its length which canprovide for efficient machining. As illustrated in FIG. 2, the uniformbody portion 232 allows for a plurality of flex circuits 100 to bealigned in a row. As well, the straight line of the body portion 232requires a single straight-line cut to separate each flex circuit 100from the adjacent flex circuit 100.

As noted above, the nested configuration of the first and second rows offlexible circuits significantly reduce the waste of the substratematerial and increase the speed of production by generating higheryields per substrate sheet. In some examples, the percentage of rawsubstrate material used to form each of the flexible circuits 100 isgreater than 80% and can be as high as 95% and any percentages inbetween. In some embodiments, the percentage of waste is as low as 5% to20% or any percentage there between. In other examples, up to 95% of thematerial of the flexible printed circuit panel array 200 can be used toform each of the flex circuits 100.

In some embodiments, each of the flex circuits 100 can be formed from aplurality of layers. FIG. 3A illustrates a perspective view of anexploded flex circuit 100 that provides a view of the construction ofthe flex circuit 100. In some embodiments, the flex circuit 100 includestraces 216 that are printed on a bottom coverlay 218. The traces 216 caninclude a copper coating while the bottom coverlay 218 can comprise apolymide material. In some examples, a top panel coverlay 214 can belayered over the bottom coverlay 218 that is printed with the traces216. The top panel coverlay can serve as a protective layer over the216. As will be discussed in more detail below, the top panel coverlaycan include strategic openings to expose the underlying traces 216 formelectrical connections on the surface of the flex circuit 100.

The flex circuit can also include a shielding layer on the top andbottom surface of the flex circuit 100 to protect the integrity of thetraces 216 and to isolate the traces 216 from external factors such asradio waves, electromagnetic fields and electrostatic fields. Asillustrated in FIG. 3A, the flex circuit 100 can include a top panelshield 212 that is layered over the top panel coverlay 214 and a bottompanel shield 220 that is layered under the bottom coverlay 218.

Each of the layers of the above described layers can have a nestedconfiguration so as to form the flexible printed circuit panel array 200illustrated in FIG. 2. For example, FIG. 3B illustrates a sheetcomprising a plurality of nested top panel shields 212. FIG. 3Cillustrates a sheet comprising a top panel coverlay 214. FIG. 3Dillustrates a “sheet” comprising a plurality of nested traces 216. FIG.3E illustrates a sheet comprising a plurality of nested bottom coverlay218. Lastly, FIG. 3F illustrates a sheet comprising a plurality ofnested bottom panel shields 220.

The flex circuit 100 can be configured to be attached to a plurality ofcomponents. In some examples, the flex circuit includes a resistor 222,an electrically erasable programmable read-only memory (“EEPROM”) 224, adetector 228, and an emitter 226. In some examples, the emitter 226 canbe an LED.

To provide an electrical connection for the plurality of electricalcomponents on the flex circuit 100, each of the layers of the flexcircuit can include strategic openings to reveal the underlying exposedtraces 217 of the traces 216. For example, the top panel coverlay 214can include a plurality of windows 215 and the top panel shield 212 caninclude a window 213 to expose portions of the traces 216. The resistor222 and EEPROM 224 can be attached to the flex circuit 100 at the window213 to provide an electrical connection between the resistor 222 withthe exposed traces 217 and an electrical connection between the EEPROM224 and the exposed traces 217.

Similarly, as illustrated in FIGS. 2 and 3A, the flex circuit 100 caninclude a detector window 229 and an emitter opening 227 to accommodatea detector 228 and emitter 226 respectively. Turning first to theemitter opening 227, the flex circuit 100 can include a hooked portionto form the emitter window 227 while maintaining a reduced profile forthe flex circuit 100. As can be seen in FIG. 2, the configuration of theemitter opening 227 allows each flex circuit 100 to be nested betweenadjacent flex circuits to form a tessellated or nested pattern. Asdiscussed above, this can maximize the use of substrate material in themanufacturing of the flex circuit 100. The emitter 226 can be attachedto the emitter opening 227 such that the emitter 226 can form anelectrical connection with the hooked portion of the traces 216. Aswell, the hook configuration provides a circular opening that allows thelight produced by the emitter 226 to be emitted.

FIG. 2B-2C illustrate an enlarged view of the detector end 206 of theflex circuit 100 with the attached detector 228 and emitter 226. FIG. 2Billustrates a top side of the detector end 206 of the flex circuit 100and FIG. 2C illustrates a bottom side of the detector end 206 of theflex circuit 100. As discussed above, in some embodiments, the emitteropening 227 is formed from a hook configuration, the end of which is notmechanically coupled to the rest of the flex circuit 100. The hookportion of the emitter opening 227 can include a top portion 227 a, afirst length 227 b and a second length 227 d. The aforementioned threeportions are configured to form an opening 227 c. The top portion 227 aand the first length 227 b form the hook portion that the emitter 226can attach to. In some embodiments, the second length 227 d is longerthan the first length 227 b. As well, in some embodiments, a distanceexists between the top portion 227 a and the second length 227 d. Insome embodiments, to maintain low profile configuration of the flexcircuit 100, the detector end 206 of the flex circuit includes an angledportion 227 e and a length 227 f that centers the detector end 206 alongthe length of the flex circuit 100. As is illustrated in FIG. 2C, thefirst length 227 b and second length 227 d form an opening 227 c forplacement of the emitter 226. The flex circuit 100 can then include anangled portion 227 e that centers the detector end 206 of the flexcircuit 100.

Another aspect of the configuration of the emitter opening 227 is theability to bend one portion of the emitter opening 227. Theconfiguration of the emitter opening 227 allows the flex circuit 227 tobe bent at the second length 227 d, such that a bend exists at theemitter opening 227. This can allow the straight flex circuit 100 to bebent to form a bent or L-shaped flex circuit. As will be discussed inmore detail below, the hooked configuration of the emitter opening 227provides a mechanical decoupling such that the flex circuit can beeasily bent without affecting the attached emitter 226.

Turning next to the detector window 229, the detector window 229 can beformed on the surface of the top panel coverlay 214 to allow light fromthe light source, such as the emitter 226, to transmit through thedetector window 229 and to the detector 228. In some embodiments, thedetector window 229 exposes the underlying traces 216. The detector 228can be attached to the detector window 229 such that the detector 228forms an electrical connection with the traces 216.

As will be discussed in FIGS. 4A-E below, the detector window 229 canvary in both shape and configuration so as to provide for varyingamounts of light from the light source to enter the detector 228. Theconfiguration and structure of each of the grid shapes can allow for thetransmission of different amounts of light so as to provide a differentfunction for the flex circuit 100.

In some embodiments, the flex circuit 100 can include a shield flap 230.In some embodiments the detector end 206 of the flex circuit 100 canform a shield flap 230. In some embodiments, the shield flap 280 can bean etched copper shield made from a copper sheet. The shield flap 230 ofthe detector end 206 can be configured to fold over the detector 228 toform a Faraday cage. The Faraday cage can provide additional shieldingto block external electrostatic fields.

FIGS. 4A-4E illustrate an enlarged view of the various embodiments ofthe detector window 229. The various shield grids are designed toprotect the circuits from electromagnetic noise interference whileallowing as much light as possible through the grid windows. FIGS. 4A-4Eillustrate the first detector window shape 410, second detector window420, third detector window shape 430, fourth detector window shape 440,and fifth detector window shape 450 respectively. FIG. 4A illustratesthe first detector window shape 410 which is located on the detector end303 of the traces 416 layer of the flex circuit 100. The first detectorwindow shield grid shape 410 includes a shield grid body 411 with acircular central window 412 a plurality of arc-shaped window 413, and anelectrical side contact 414 on either side of the windows. In theconfiguration shown in the first detector window shape 410, the circularcentral window 412 is centered on the bottom portion of the shield gridbody 411 between the pair of side contact 414. In this configuration,the first detector window shape 410 also includes four arc-shapedwindows 413 that are spaced about the circular central window 412. Insome embodiments, the circular central window 412 of the first detectorwindow shape 410 allows a significant portion of light through to thedetector while still blocking electromagnetic interference.

FIG. 4B illustrates the second detector window shape 420 which islocated on the detector end 303 of the traces 426 layer of the flexcircuit 100. The second detector window shape 420 includes a shield gridbody 421 with a plurality of narrow rounded rectangular windows 422 andside contacts 424 on either side of the plurality of narrow roundedrectangular windows 422. In the configuration shown in the seconddetector window shape 420, the narrow rounded rectangular windows 422have four narrow rounded rectangular windows 422 that are located on theshield grid body 421 between the two side contacts 424 on either side ofthe shield grid body 421.

FIG. 4C illustrates the third detector window shape 430 which is locatedon the detector end 303 of the traces 436 layer of the flex circuit 100.The third detector window shape 430 includes a shield grid body 431, acentral window 432, a plurality of rectangular windows 433, and sidecontacts 434 on either side of the central windows 432. In theconfiguration shown in the third detector window shape 430, theplurality of rectangular windows 433 and the central window 432 arecentered on the bottom portion of the shield grid body 431 between thetwo side contacts 434. In some embodiments, the two rectangular windows433 are located above and below the central window 432.

FIG. 4D illustrates the fourth detector window shape 440 which islocated on the detector end 303 of the traces 446 of the flex circuit100. The fourth detector window shape 440 includes a shield grid body441, a central window 442, a plurality of narrow rectangular windows443, and a side contact 444 on either side of the central window 442. Inthe configuration shown in the fourth detector window shape 440, thenarrow rectangular window 443 and the central window 442 are centered onthe bottom portion of the shield grid body 441 between the two sidecontacts 444. In some embodiments, the two narrow rectangular window 443are located above and below the central window 442.

Lastly, FIG. 4E illustrates the fifth detector window shape 450 which islocated on the detector end 303 of the traces 456 of the flex circuit100. The fifth detector window shape 450 includes a shield grid body451, a central window 452, a plurality of side contact 454, and a sidecontact 454 on either side of the central window 452. In theconfiguration shown in the fifth detector window shape 450, the centralwindow 452 and the plurality of trapezoidal window 453 are located onthe bottom portion of the shield grid body 451. In some embodiments,each of the plurality of trapezoidal window 453 is located one side ofthe central window 452 such that the shorter end of the trapezoid isproximate to a side of the central window 452.

The configuration of the two sheet flexible printed circuit panel array300 provides for a larger number of sensors to be assembled at the sametime. Once all of the components have been attached and assembled oneach of the sensor assemblies, each of the sensor assemblies 644 can besealed in protective material. As illustrated in FIGS. 5A-5D, in someembodiments, the sensor assemblies can include top and bottom portions646. For example, in some embodiments the sensor assemblies can coveredon both top and bottom with a layer of foam 646. The foam coveringcovers the flex circuit and traces and forms a cable covering whichextends from the emitter and detector assemblies to a connector end ofthe flex circuit. In some embodiments, a top foam 646 and a bottom foam646 can be sealed together to sandwich the flex circuit such that thesensor assembly is entirely covered by the foam.

In some embodiments, each of the sensor assemblies 644 can include a tophead tape 636 and a bottom head tape 636 attached to cover eachindividual sensor. In some embodiments, the top head tape 636 can be thesame size as the bottom head tape 636. In some embodiments the top headtape 636 can have a design such as sensor artwork or logos printed onits top surface. In some embodiments, after the bottom head tape 636 andthe top head tape 636 have been attached to the sensor assembly, thesensor assembly can be laminated.

Each of the sensor assemblies can further include a bottom and topconnector tab. The connector tab provides the sensor assembly 644 with astructure to allow the sensor 644 to attach to a connector. FIG. 5Aillustrates an example of a sensor assembly 644 with connector tabsattached. In some embodiments, the bottom connector stiffener 656 caninclude a flex circuit mating area 658. In some embodiments, theresistor end of the sensor 644 is placed such that the exposed tracesdiscussed in FIG. 2 lie on the surface of the proximal tongue 657. Theflex circuit mating area 658 can be configured to connect with the topportion of the connector assembly. Prior to the placement of the sensor644 on the bottom connector stiffener 656, a bonding agent such as glueor epoxy can be applied to the bottom connector stiffener 656. Onceapplied, the sensor 644 can placed on the bottom connector stiffener 656with component side facing upwards. In the embodiment pictured in FIG.5A, the flex circuit mating area 658 portion of the bottom connectorstiffener 656 is located on either side of the sensor 644. Once thesensor 644 is attached to the bottom connector stiffener 656, the topportion of the connector tab is attached to secure the sensor 644. Insome embodiments, the underside of the top connector stiffener 662 has amating area that corresponds to the flex circuit mating area 658 suchthat the top connector stiffener 662 and flex circuit mating area 658are secured together. In some embodiments, the top connector stiffener662 and flex circuit mating area 658 are secured using a lockingmechanism or a fastener. The top connector stiffener 662 and the bottomconnector stiffener 656 can be secured together by a press fit,interference fit, a snap fit, etc. FIG. 5B illustrates the sensor 644with the connector stiffener 652 assembled onto the connector end of thesensor 644.

Finally, the sensor assembly 644 can optionally include a printed linerand applicator tape. FIGS. 5C-5D illustrate a top perspective view ofthe sensor 644 with the added printed liner and the applicator tape.FIG. 5C provides a top view of the sensor 644 and a top and perspectiveview of the sensor 644 with the printed liner 664 added. The printedliner 664 can be printed with a variety of designs and/or colors. As canbe seen in FIG. 5C, the printed liner 664 can be long enough to fit thelength of the head tape 636 section of the sensor assembly 644. FIG. 5Dillustrates a top and perspective view of the sensor assembly 644 withprinted liner 664 and added applicator tape 668. The applicator tape 668can have a variety of shapes and sizes. In some embodiments, the 688 hasa length and width that can fit onto the printed liner 664.

As described above, another benefit of the present configuration of theflex circuit design is the ability to assemble a bent sensor from thelinear flex circuit described above. FIG. 6A illustrates a flowchartthat describes an embodiment of a method of sensor folding 500. FIGS.6B-6D illustrate a method of sensor folding 800 that corresponds withthe steps of the flowchart shown in FIG. 6. As discussed earlier,although FIGS. 6A-D describe the formation of an “L-shaped” sensor, thesteps described can be applied to fold the flex circuit into a sensorthat is bent at an angle greater or less than 90 degrees.

The method of sensor folding 500 can include block 510 which describesfolding the flex circuit through the centerline of the emitter such thatthe detector is facing a second direction. FIG. 6B illustrates thesensor prior to folding. As seen in previous figures, the sensor 644includes a detector 640, an emitter 650, and a neck 630 connecting thedetector 640 with the emitter 650. As discussed above, the neck 630 isformed from a second length 227 d, an angled portion 227 e and anotherlength 227 f which is configured to maintain the straight configurationof the flex circuit 100. As discussed above, the second length 227 d isinitially angled to one side to form the opening 227 c that accommodatesthe emitter 226.

In the configuration of FIG. 6B, the detector 640 and emitter 650 bothface a first direction such that the detector window and emitter openingboth face a second direction. FIG. 6C illustrates the sensor 644 with afirst fold 610 through the centerline of the emitter 650. In thisembodiment, the first fold 610 is at a 45 degree angle with theremaining length of the sensor 644. In other embodiments, the angle ofthe first fold 610 can range from 0-180 degrees. The first fold 610creates a fold in the neck emitter opening such that the detector 640 isfacing a second direction, with the detector window facing a firstdirection.

Once the first fold is made, the method of sensor folding 500 canfurther include block 520 which describes folding the flex circuit asecond time such that the two folds—the first fold and the secondfold—form a 45 degree angle and the detector is now facing a firstdirection. FIG. 6D illustrates the second fold 620 of the L-shapedsensor 660. The second fold 620 and the first fold 610 form fold angleα. In some embodiments, the fold angle α is at a 45 degree angle. Thesecond fold 620 also turns the detector 640 such that it is facing afirst direction and the detector window is facing a second direction. Inthis way, the direction of the detector 640 and detector window arefacing the same directions as they were prior to folding. After folding,a head tape, applicator tape and liner can be added to finish the sensorsimilar to those described above. Moreover, the folding of the sensorflex circuit can occur at any time during the manufacturing process andis not limited to any particular sequence of sensor construction.

Finally, all of the sensors discussed above can be reprocessed orrefurbished. The reprocessing or refurbishing of physicological sensorsinvolves reusing large portions of an existing sensor. The reprocessedor refurbished sensor therefore has material costs that aresignificantly lower than making an entirely new sensor. In one example,the reprocessing or refurbishing of the sensor can be accomplished byreplacing the adhesive portion of the sensor and reusing the sensingcomponents. In other examples, the process for reprocessing orrefurbishing sensors involves replacing the sensing components of thesensor. One such example is described in U.S. Pat. No. 8,584,345entitled “Reprocessing of a physiological sensor,” which is assigned toMasimo Corporation, Irvine, Calif., and incorporated by referenceherein.

Although this disclosure has been disclosed in the context of certainpreferred embodiments and examples, it will be understood by thoseskilled in the art that the present disclosure extends beyond thespecifically disclosed embodiments to other alternative embodimentsand/or uses of the disclosure and obvious modifications and equivalentsthereof. In addition, while a number of variations of the disclosurehave been shown and described in detail, other modifications, which arewithin the scope of this disclosure, will be readily apparent to thoseof skill in the art based upon this disclosure. It is also contemplatedthat various combinations or sub-combinations of the specific featuresand aspects of the embodiments may be made and still fall within thescope of the disclosure. Accordingly, it should be understood thatvarious features and aspects of the disclosed embodiments can becombined with or substituted for one another in order to form varyingmodes of the disclosed

1-31. (canceled)
 32. A sensor assembly comprising: a first endcomprising a connector; a body portion; and a second end comprising: astructure configured to support a first component, a neck portion, and ahook extending from the neck portion, the hook and the neck portionbeing configured to support a second component.
 33. The sensor assemblyof claim 32, further comprising a plurality of traces extending from thefirst end to the second end, at least one of the plurality of tracesextending from the first end to the hook.
 34. The sensor assembly ofclaim 32, wherein an end of the hook is not mechanically coupled to theneck portion.
 35. The sensor assembly of claim 34, wherein the neckportion is curved.
 36. The sensor assembly of claim 32, wherein the hookand the neck portion together form a circular opening configured tosupport the second component.
 37. The sensor assembly of claim 32,wherein the first component comprises a detector, and the secondcomponent comprises an emitter.
 38. The sensor assembly of claim 37,further comprising the first component and the second component.
 39. Thesensor assembly of claim 32, wherein the neck portion is configured tobe bent without affecting an electrical operation of the secondcomponent when the second component is supported by the hook and theneck portion.
 40. The sensor assembly of claim 32, wherein the neckportion is configured to be bent proximate to where the neck portionsupports the second component without affecting an electrical operationof the second component when the second component is supported by thehook and the neck portion.
 41. The sensor assembly of claim 32, whereinthe neck portion is configured to fold a plurality of times withoutaffecting an electrical operation of the second component when thesecond component is supported by the hook and the neck portion.
 42. Thesensor assembly of claim 32, wherein the neck portion is configured tofold to form an angle of 45° so that the body portion extends in adirection perpendicular to a line between the first component and thesecond component when the first component and the second component aresupported by the second end.
 43. The sensor assembly of claim 32,wherein the body portion extends in a common direction to a line betweenthe first component and the second component when the first componentand the second component are supported by the second end.
 44. The sensorassembly of claim 32, wherein the second end comprises a flap configuredto fold over the first component.
 45. The sensor assembly of claim 44,wherein the flap comprises a copper sheet.
 46. The sensor assembly ofclaim 32, wherein the structure comprises a circular window and aplurality of arc-shaped windows disposed around the circular window. 47.The sensor assembly of claim 32, wherein the structure comprises aplurality of rectangular windows.
 48. The sensor assembly of claim 32,wherein the structure comprises a first rectangular window, a secondrectangular window, and a third rectangular window, the firstrectangular window being larger than the second rectangular window andthe third rectangular window.
 49. The sensor assembly of claim 32,wherein the structure comprises a square window, a first rectangularwindow, and a second rectangular window, the square window being locatedbetween the first rectangular window and the second rectangular window.50. The sensor assembly of claim 32, wherein the structure comprises arectangular window and a plurality of trapezoidal windows, the pluralityof trapezoidal windows being disposed around the rectangular window. 51.The sensor assembly of claim 32, wherein the connector comprises a topstiffener and a bottom stiffener secured together by a press fit, aninterference fit, or a snap fit.